dicing

英 [ˈdaɪsɪŋ]

美 [ˈdaɪsɪŋ]

v.  将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词

计算机

柯林斯词典

• 骰子;色子
  Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form.
• 掷骰子游戏
  Diceis a game which is played using dice.
• VERB 把(食物)切成小块;将…切丁
  If youdicefood, you cut it into small cubes.
  1. Dice the onion...
     把洋葱切成丁。
  2. Add the crushed garlic and remaining diced vegetables.
     加入捣碎的大蒜和剩余的蔬菜丁。

双语例句

• Our process training would cover variety of topics from choosing the right blades to setting an appropriate dicing process for various materials and applications.
  我们的工艺培训可以涵盖不同的主题，包括面对不同材料和应用该如何选择合适的刀片到设置适当的工艺参数等。
• The system functions mainly include macro dicing, micro planning and district demolition.
  该系统主要有学校宏观划片、微观规划和片区拆迁等功能。
• Study on Mechanism and Driving Error of θ Axis for the Abrasive Dicing Saw
  砂轮划片机θ向机构和传动误差分析
• In OLAP processing, slicing and dicing is often performed along a time axis to analyze trends and find time-based patterns in the data.
  在OLAP的加工，切片和切割往往是演出沿着时间轴来分析发展趋势，并抽出时间为基础的模式中的数据。
• The Technology Study on UV Laser Dicing High Brightness LED Wafer
  高亮度LED晶圆紫外激光划片技术研究
• Performance analysis and three-dimensional modeling of wafer dicing with diamond blade
  金刚石砂轮刀片划切过程性能分析与三维建模
• Introduces the development of semiconductor industry, the characteristic of laser wafer dicing technology, the structure of laser wafer dicing machine, and the application in the production.
  介绍了半导体行业的发展，晶圆激光划片技术的特点、激光划片系统的组成与其在实际过程中应用。
• Alphablox provides drill-down and slicing and dicing capabilities that can answer the types of business questions that we asked earlier.
  Alphablox提供向下钻取和细分功能，以回答我们先前提出的业务问题。
• Just like tags for requirements, categories of your test cases can be invaluable for slicing and dicing your testing data so that you can determine what's really happening.
  就像对于需求的标签一样，测试用例的范畴对于切割测试数据以便决定到底发生了什么来说是无价的。
• In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
  本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。